RS-300Q set for SMD/BGA rework

RS-300Q set for SMD/BGA rework

  • Integrated device: HOT-AIR station, quartz preheater and control computer
  • 3 zone quartz preheater
  • Preheater of A3 size
  • Power of lower preheater: 3.4kW
  • Power of upper preheater: 500W
  • Smooth temperature adjustment of lower preheater and air flow
  • 3 external thermocouple socket
  • Stabile stand with adjustable XYZ axis
  • Intuitive software
  • Large, 7-inch colour touch screen
  • Possibility of programming an unlimited number of profiles
  • Editing process parameters in real time

APPLICATION

  • Set for repairs of:
  • Xbox
  • Playstation
  • Graphic cards
  • Notebooks
  • Gsm
  • Pda
  • Net devices
  • Rtv/agd
  • Telecomunication equipment
  • Other large main pcbs

ADVANTAGES

  • High power of heating element and stable stream of air - work with components CHIP, SO, QFP, PLCC, BGA
  • Non-contact assembly and disassembly of components with hot air
  • Microprocessor controlled, precise stabilization of the temperature and air flow
  • Large and clear display
  • Longer service life of the heating element - microprocessor protection
  • Large selection of stainless steel nozzles
  • Nozzles replaced in seconds
  • As standard round nozzle and modern nozzles installation adapter
  • The unique cooling function of heating element after power off
  • Quartz heating elements covered with steel protective mesh

TECHNICAL DATA

  • Power supply: 230 V AC, 50-60 Hz
  • Power: 3.4kW
  • Air flow control range: 2-20 l/min
  • Temperature range: 100oC - 350oC
  • Outer dimensions: 480mm x 460mm x H 190mm
  • Weight: about 20kg

Standard equipment

  • RS-300Q station
  • Power cord
  • Adapter for REECO nozzles
  • RE-PN50 nozzle
  • Set of stands

Optional equipment

  • BGA nozzles
  • Universal nozzles

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