Set for SMD/BGA reworks REECO-A3

Set for SMD/BGA reworks REECO-A3


  • Cooperation with preheater and station stand, enables performing works impossible to do by manual operation and components positioning
  • Repair kit for: xbox, playstation, graphic cards, notebooks, mobile phones, telecommunication equipment, motherboards and other big PCBs
  • 12 months warranty

Set contains

  • Microprocessor RA-250e station for hot air assembly and disassembly of SMD/BGA components.
    Microprocessor controlled.
  • PCB preheater RE-PH-A3 - convection heating with a high heat capacity heating plate.
    Large working area: 300 x 420 mm
  • Stand - stabile plate attachement and precise positioning of a component.
    Adjustment of X, Y, Z.
    PCB mounting with dimensions of 480 x 300 mm.
  • Software for RE-RA250 station - menagement of the set, programming, process control and archiving.
    Software provides control and modification of the process at the PC monitor.
  • Nozzles
    With set - one standard nozzle
    Optional - square nozzles
  • Adapter for nozzles - enabling use of REECO nozzles with stations of many manufacturers.
  • Vacuum tweezer allows you to lift components. Included with the tweezer are also 3 rubber suction cups for different sizes of components.
  • Thermocouple type K - temperature control
    One thermocouple attached to the station and three thermocouples supplied with the preheater

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