3 independent heating zones, ensures uniform temperature distribution on the PCB

Convection heating through the high thermal capacity heating plate + blow by large number of holes in the heating plate (44 holes for each zone)

Temperature adjustment independent on each zone up to 350oC and +/-5oC stabilization

Large working area: 300 x 420 mm

Works with the RA-250 station and software

14 mm thick heating plate made of special aluminum alloy integrated with heating element

High performance and efficient transfer of heat through the air, makes heating zone similar to that which prevails in the soldering ovens

Protection against heat tensions (no effect of deformed plates)

Temperature measurements with three external thermocouples

Software-controlled temperature increase

Airflow adjustement in range of 0- 100%

Large, clear display indicating all the parameters: set temperatures on each of the three zones the actual temperature at each of three zones, given flow of hot air on each of the three zones the actual temperature at each of the three thermocouples

Possibility of effective and safe assembly/disassembly of BGA components on problematic PCBs: X-BOXes, PLAY STATIONs III, NOTEBOOKs, SERVERs etc.

PCB preheating before assembly/disassembly process

Solder removal

Regeneration of BGA components

Working with SMD/BGA components

High durability and lifetime warranty on housing

Unit designed on the highest world level

High quality components used to manufacture the system

Separated heating chambers from control chamber

Individual cooling of control chamber

Effective insulation, separating the heating plate from housing of the system