Preheater HP-580

Preheater HP-580

  • Aluminium hot plate assures excellent energy transfer to preheated application
  • Automatic process control and fault signalling
  • Precise, digital control and temperature measurement
  • Three digit display
  • Even heating of whole hot plate area
  • Safety device against overheating


  • HP-580 hot plate after choosing right stencil and solder balls in an excellent set for fast and always effective BGA and µBGA components regeneration.
  • BGA regeneration
  • PCB preheating before rework process
  • Solder removal
  • SMD/BGA rework


  • Precise digital steering and controlled PCB preheating
  • Excellent co-operation with hot air rework stations, enables to build very effective work station and possibility of performing all kind of repairs, even the newest equipment

Technical data

  • Input power
    230 V AC
  • Max. power consumption
    1150 W
  • Temperature range
    50 - 350°C
  • Dimensions
    200 x 146 x 200 mm
  • Weight
    4,75 kg

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